Main Inspection Capabilities:

1. Applicable Materials: Ferromagnetic and non-ferromagnetic conductive metals, including carbon steel, stainless steel, aluminum, etc.;
2. Application Scope: Detection of surface and near-surface defects in metal structures;
3. Applicable Defects: Capable of effectively detecting surface cracks and other linear defects.
4. Inspection Depth: Maximum depth for carbon steel is 3mm; for stainless steel is 5mm; for aluminum is 8mm.
5. Detection Sensitivity: Capable of detecting surface-opening defects as small as 3*0.5*0.2mm; can detect defects equivalent to those on Magnetic Particle Inspection (MPI) A1 15/100 test piece.
6. Detection Stability: Minimum defect detection rate greater than 90%.
7. Permissible Coating Types: Non-conductive coatings such as paint, epoxy resin, asphalt, etc.
8. Permissible Coating Thickness: Maximum coating thickness ≤ 5mm; when used with a large coil probe, can inspect coatings up to 10mm thick.
9. Scanning Speed: Maximum scanning speed ≤ 60mm/s, minimum scanning speed should be > 5mm/s.
10. Can perform inspections at temperatures up to 500°C when paired with a high-temperature probe.

Instrument Requirements:

1. Display: 10.1-inch multi-touch display with backlight support.
2. Resolution: High-definition display, resolution 1920*1080.
3. RAM: 4GB, expandable to 8GB.
4. Storage: 32GB internal storage, expandable up to 128GB.
5. Operating System: Android OS (based on Linux kernel).
6. Interfaces: 1*USB3.0/USB2.0 HOST port, 1*Type-C port (charging only).
7. Network Interface: Supports Wi-Fi connection; expandable to support 4G dongle.
8. Charging Interface: Type-C port, integrated with FCP input/output fast charging protocol, AFC input/output fast charging protocol, DRP Try.SRC protocol, PD3.1 input/output fast charging protocol, QC2.0/QC3.0/QC3.0+ output fast charging protocol.
9. Maximum Charging/Discharging Power: 45W.
10. Maximum Operating Time: 16 hours.
11. Host Dimensions: 303mm * 224mm * 85mm.
12. Weight: ≤ 3.7kg.
13. Operating Temperature: -10°C to 40°C.
14. Operating Humidity: ≤ 90% relative air humidity.

Hardware Function Requirements

1. Supports multiple probe types, including pencil probe, standard probe, and conventional array probes.
2. Supports rotating field probe for multi-directional defect detection (Optional).
3. Supports "Tooth" array probe; can be expanded to support other unconventional array probes (Optional).
4. Supports high-temperature probe with synchronous temperature compensation function (Optional).
5. Supports encoder for real-time recording of spatial displacement during inspection.
6. Can display Bx signal plan view, Bz signal plan view, butterfly diagram, and gradient diagram.
7. Array probe inspection can display color contour maps.
8. Supports adjustable inspection frequency, range 1kHz - 10kHz.
9. Supports adjustable signal intensity, either automatic or manual adjustment.
10. Supports hot-swapping of probes, allowing probe changes during inspection.
11. Supports hot-swapping and disconnection of the encoder.
12. Supports probe button function: Buttons on the probe can control software scanning functions (e.g., start, stop, refresh).
13. Supports customization and expansion of non-standard probes (Optional).

Software Function Requirements

1. System software runs on Android platform, capable of device control, signal acquisition, analysis, etc.
2. Software can display status information such as probe connection, inspection parameters, battery level.
3. Supports creating new project files, which include basic inspection settings, inspection data, and inspection reports.
4. Supports importing/exporting project files to view or set inspection parameters.
5. Supports parameter settings for part type, material, coating thickness, weld width, part temperature, etc.
6. Features parameter recommendation function, suggesting suitable probes and parameters based on set inspection object information.
7. Features instrument sensitivity adjustment function, allowing calibration using standard test blocks.
8. Features defect depth coefficient calibration function, allowing depth coefficient setting using reference test blocks.
9. Features excitation adjustment function, allowing adjustment of inspection frequency and excitation level based on the inspection object, with automatic adjustment of instrument gain.
10. Inspection interface vertical axis supports switching between follow mode and fixed mode, adjustable at any time.
11. Features inspection image zoom function, allowing manual zoom and horizontal dragging for result viewing.
12. Features image reset function, allowing one-click restoration of zoomed or dragged images.
13. Supports inspection image replay function for multiple reviews.
14. Features marking function. Clicking the mark button during inspection adds dividers to the inspection image for segmented display in reports.
15. Supports defect sizing function. After identifying a defect, selecting its area allows calculating defect length based on encoder data. Surface opening defect depth can be calculated based on Bx signal variation.
16. Supports custom inspection report formats and report export function.
17. Supports viewing inspection reports, images, and data from historical project files.

1. Host Unit: 1 unit.
2. Signal Acquisition and Analysis Software: 1 set.
3. Pencil Probe: 1 unit.
4. Standard Probe (with encoder): 1 unit.
5. Three-Element Array Probe: 1 unit.
6. Probe Connection Cable: 1 unit.
7. Charger: 1 set.
8. Product User Manual: 1 set.
9. Quality Documentation: 1 set.
10. Other probes optional.
11. Instrument Case: 1 set.